Those of you using a no-clean/low-residue soldering solution in your manufacturing operations, I have some questions concerning flux compatibility. What problems have you encountered between no-clean paste, liquid flux at wave solder and benchtop soldering no-clean flux(hand soldering)? I am strongly considering a water based no-clean for wave solder to try to reduce VOCs contribution at this facility. Will this direction limit the flexibility of the SMD area to choose their no-clean paste, or, perhaps the hand soldering side be limited in their flux selection? I would appreciate some feedback and thanks in advance. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************