Andy,

A variety of methods exist for creating blind vias.  Generally speaking, the 
most cost effective options are microvia technologies.  Technologies such as 
photovias and plasma technologies are generally more cost effective than 
controlled depth drilling.  Lasers are also an option to mechanical drilling.  
Plasma and photovia blind vias are mass produced -- the cost of 50,000 blind 
vias from layer 1 to 2 and n to n-1 are the same as the cost of one microvia.

Merix produces blind microvias using a plasma process known as DYCOstrate.  I 
would be happy to discuss this technology further or send you more information 
about the process if you are interested.

John Stewart
email:    [log in to unmask]
phone:  503.359.2674
fax:        503.357.1234
www:     www.merix.com

"Andrew Buonviri"<[log in to unmask]> Wrote:
| 
| 
| 
| 
| 
|   My company is looking to design a multilayer PCB with blind vias. 
| Another
|   company will do the actual fab. I've heard there's more than one 
| way to
|   do blind vias: either controlled depth drilling or fabbing and 
| drilling
|   two halves of a board separately and sticking them together. Does 
| anyone
|   have any experience with either of these methods, and is there 
| another
|   way I don't know of? Which way is better, what are the risks, etc? 
| Any
|   info would be appreciated. Thanks,
|   Andy Buonviri
|   Ixthos, Inc.
|   [log in to unmask]
| 
| 
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