I have a mixed technology circuit board where I have leaded components on 
one side of the board and surface mount components on both sides.  Normally, 
this would not be a problem as I would solder the leaded components and the 
"backside" surface mount parts by wavesoldering.The components on the 
"backside" in this case are  DPAK  Mosfets which I do not want to send 
through my wave. Therefore, I am planning to dispense solder paste and 
reflow this side of the board separately.

I have a Camalot machine with a positive displacement pump that I can use 
for this purpose.

My questions are:

1)  What size needle and time durations would be suitable for dispensing 
paste. (I'm planning to use Kester 596 solder paste, SN63, 90% MC, -325/+500 
Mesh).

2) Do you buy the solder paste in syringes or can you effectively fill 
disposable carrtridges.

3) Is my approach too cautious ?? Send the DPAK components through the wave 
anyway ?

Thanks in advance for any reponses. Ican be reached on the "Net" or I can be 
e-mailed directly  at   [log in to unmask] .


Bill Kasprzak
Moog Inc.
East Aurora, NY     716-652-2000   ext 2507    /    Fax    716-687-4378

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************