We've used all types here.  For the kind of application you describe, our
greatest successes have come with DeltaBond, a "liquid" ceramic loaded
epoxy, from Wakefield, several sheet epoxies from AbleStik, a loaded
urethane from WR Grace, and an alumina loaded Kapton tape with acrylic
adhesive on both sides whose manufacturer's name escapes me at the moment.
DeltaBond is probably the cheapest and comes in premeasured duopacks.
Each, however, has plusses and minuses depending on the stresses induced on
the assembly and lots of other considerations.  Good luck.
        Howard Feldmesser
        The Johns Hopkins University Applied Physics Laboratory

>We have an application were we need to bond a small heatsink to the top
>of a plastic packaged device (bonding area is approx 1.0" x 0.5").
>We are undecided whether we should use a self adhesive  thermally
>conductive sheet material to bond the two together, or use a thermal
>bonding compound (liquid adhesive). Due to the size and implementation,
>mechanical methods of securing the heatsink are not suitable.
>
>Any advice or experiences people have had with either or both of the two
>methods would be appreciated
>
>
>
>Ron Wedemeyer
>Senior Engineer - Product Engineering
>QPSX Communications Pty Ltd
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