IPC-S-816, "SMT Process Guideline and Checklist," may help so long as
you are wave soldering SMT assemblies. It covers reflow and
vapor phase too.
The format is observed condition (effect)->potential cause->corrective
action. For wave soldering,
some of the observed conditions include: solder skips, bridges, unfilled
vias, board overflooding, grainy or disturbed joints, cracked components,
cold joints, solder balls, etc.
The document is available from IPC's order dept., ext. 318. Price: $15
IPC members/30 nonmembers.
Mike Buetow
IPC Technical Staff
2215 Sanders Road
Northbrook, IL 60062
P: 847-509-9700, ext. 335
F: 847-509-9798
[log in to unmask]
On Fri, 26 Jul 1996, Ed Gavin wrote:
> We are a Contract Manufacturer and consequently see many
> varieties of Printed Circuit Board assemblies. We have Tech Devices
> Wave and Aqueous machines.
>
> I would like to see if I can obtain/purchase any documented
> guidelines for solving various process problems for the wave
> soldering/cleaning processes. The more practical approach versus
> the theoretical approach is most desired.
>
> EMail: [log in to unmask]
>
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