We would need information and acceptance criteria on thermal shock testing 
of blind and buried vias.
The idea is to design the vias to form chain patterns and measure their 
resistance/resistance change during thermal shock.
Does anyone have experience on this or know of any standard test 
pattern/method/conditions/ acceptance criteria?
Your help is highly appreciated.
Please, respond as soon as possible to IPC TechNet or directly to:
          Liisa Mustala
          Nokia Telecommunications
          e-mail: [log in to unmask]