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1996

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Subject:
Re: Unidentified subject!
From:
[log in to unmask] (Karl Sauter)
Date:
Mon, 10 Jun 1996 11:32:27 -0700
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text/plain (25 lines) 
Martin,

We use the following for process monitoring:

 ________________________________________________________
 BGA Site X-Ray Inspection Standards/Criteria
 Ref. 9/28/95

 1. Maximum 25 percent of BGA joint area can be voids.
 2. Maximum void diameter is 30 percent of BGA joint area
    diameter.


Regards,


Karl Sauter
Staff Engineer - PWBs
Sun Microsystems, Inc.
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