Bill,
     
        As far as waving SOIC's go, I've yet to have any problems 
     concerning heat. That goes without saying provided the IC's haven't 
     absorbed a lot of moisture...ya' know package cracking, or "popcorn 
     effect". IPC-SM-786A talks about the handling of moisture sensitive 
     IC's and really focuses on the reflow aspects, but the way I look at 
     it, heat is heat, no matter where it comes from. The -786A does 
     acknowledge that wave soldering is a concern, but it is outside the 
     scope of that publication...I figure if you follow the guidelines that 
     are in there, ya' can't go wrong.
     
        Now SOT's are another story. You should look closely at the type of 
     plastic that is being used for the body, and talk to the vendor to 
     find out if it's okay to wave them. I'm saying this because I have ran 
     across some SOT's every once in a while that couldn't take the kind of 
     heat coming from the wave...they would come out kind of "blistered" 
     looking.
     
        One last thing about SOT's and using them on the bottomside during 
     wave. I've run across a lot of people that didn't know you could buy 
     SOT's in different height profiles, even component distibutor rep's 
     didn't know! They come in low, medium, and high profiles. Basically, 
     it's how high the body sits off the board. For bottomside epoxy, ya' 
     wanna' get low profile SOT's. That's because the height of the glue 
     dot that you'll need to contact the bottom of the body on a high 
     profile SOT will probably mean that you'll wind-up bleeding some of 
     the glue on the pads because of the resulting dot diameter, and that 
     epoxy makes good solder mask too if ya' know what I mean.
     
     
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