I am talking about primary image, not solder mask, at least for the moment.

My apologies for not having the correct address on my first submission.  
Our internet access provider has us on some kind of a "party line" 
arrangement.  Unless I specify when first logging on what my ID is, 
messages will be sent under the ID of the last person to specify and ID.

Lou


.

On Wed, 19 Jun 1996, sbryan wrote:

>      Are you talking about primary image or solder mask?
> 
> 
> ______________________________ Reply Separator _________________________________
> Subject: FAB:  photoresist adhesion - testing and process control
> Author:  [log in to unmask] at corp
> Date:    6/19/96 8:32 AM
> 
> 
> Last month there were some brief discussions of resist adhesion.  Using 
> ASTM D3359-87(a cross-hatch test) was suggested.
>      
> My questions are:
>      
> 1)  is anyone using such a test for testing acceptance of laminated 
> photoresist?
>      
> 2)  is anyone using such a test for process control in lamination or 
> exposure or developing of photoresist?
>      
> 3)  what defects can appear if adhesion is too low?
>      
> 4)  what defects can appear if adhesion is too high?
>      
> I would like to discuss these with any interested parties.
>      
> Lou Hart
> 412-858-6117
> compunetics
> .
>      
>