Dear Technet,

Can anyone direct me to the results of any studies into the relative 
effectiveness of "encapsulating" all PCB traces between outer layer 
ground planes (of multilayer PCBs) to minimise electromagnetic emissions? 
We are contemplating adding this feature to designs which are about to 
enter CAD, but have yet to be convinced that the (routing) "pain" is 
worth the "gain". Failing that, a summary of anyone's practical 
experience with this or any other (EMC-enhancing) technique would be 
greatly appreciated.

Andrew Linahan

(Manufacturing Test Manager)
QPSX Communications Pty Ltd
Private bag 24
West Perth 6005
Western Australia

tel. +61 (09) 262 2000
fax. +61 (09) 324 1642
email [log in to unmask]


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