Vince, Harlan:

You might consider removing several of the connections to the ground 
plane and adding vias to the unconnected layers.  Limiting the 
connections to one or two planes would to reduce the thermal mass tied 
to the solder connection while the via(s) would provide the necesary 
current carrying capacity.

Don Vischulis
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-----------------------------------------------------------------------Vince, Harlan wrote:
> 
>      Please bear with me on this one......
> 
>      I have a 12 layer PWB(Backplane) with 8 ground planes(all 2 oz.).
>      Each connector on this assembly has several pins that connect to
>      all 8 ground planes.  Each connection is thermally relieved by 4
>      separate .010" traces(spoked).  Each trace is .035" in length.
>      The connectors that are on the top layer have been successfully
>      flowsoldered, but I have several on the rear layer that require
>      handsoldering.  I am concerned for the handsoldered connections
>      and any repair required to the top connectors following
>      flowsolder.
> 
>      Does anyone have experience with this type of design and/or are
>      there any guidelines that might help me in reevaluating this
>      design.
> 
>      Thanks in advance.
> 
>      Harlan
>      [log in to unmask]
> 
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