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1996

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Subject:
From:
Bill Dieffenbacher <[log in to unmask]>
Date:
Thu, 19 Dec 1996 03:34:04 -0600
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Technetters:

I received the following questions from a colleague (John Northrup).  If you
know anything about this topic please respond either to John or myself.

Thanks in advance for your help.

Happy Holidays!

Bill Dieffenbacher




I am trying to locate information relating to the actual usage of Plastic Ball
Grid Arry (PBGA) devices. I am interested in info relating to the mounting,
temperature cycling, problems, and long term field performance of this type of
device.

Am also searching for data that illustrates whether plastic microcircuit 
packages will support the growth of a fungus, or not. Should I be concerned, or
not, and why....?????


JOHN E. NORTHRUP (607)-770-3173 [log in to unmask]


~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Bill Dieffenbacher		   Tel. (607)770-2961
Lockheed Martin Control Systems	   Fax. (607)770-2056
600 Main St.  Room R52F            email [log in to unmask]
Johnson City, NY  13790
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~

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