Subject: | |
From: | "Magee, Andrew P" <"andrew.p.magee"@rogers-corp.com> |
Date: | Fri, 01 Nov 1996 07:57:00 -0800 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
---------------------------- Forwarded with Changes
---------------------------
From: dhickey::(DHICKY) at ~FABRIK
Date: 11/1/96 4:32AM
To: Andrew P Magee at Rogers-MCD
*To: 27=technet::[log in to unmask]::25=SMTP at ~FABRIK
Subject: Insulating layer
----------------------------------------------------------------------
---------
From the world of flex circuits.........
We routinely encapsulate circuits using an adhesive covered
polyimide coversheet. These materials can be punched or
drilled to match any pattern of openings that you require
and laminated to the board as a sheet or pieces.
Typically the adhesive is 0.001" and the polyimide is
0.0005", 0.001", 0.002", 0.003" or 0.005". The polyimide
provides >7000 V/mil and the adhesive gives >3500 V/mil
dielectric strength.
Our R/flex 2005 system is listed as UL94 V-0, 105C
continuous operating temp., and also carries the Delta mark
for use up to 120V and 15A.
Andy Magee - Applications Engineer
Rogers - Circuit Materials
Tel: (602) 917-5237
Fax: (602) 917-5256
E-Mail: [log in to unmask]
Website: http//www.rogers-corp.com/cmu
////////////////////////////
// SERVICE TO THE LINE, //
// ON THE LINE, //
// ON TIME. //
////////////////////////////
______________________________ Forward Header
__________________________________
Subject: Insulating layer
Author: dhickey::(DHICKY) at ~FABRIK
Date: 11/1/96 4:32 AM
From: [log in to unmask]
Date: Fri, Nov 1, 1996 4:32 AM
Subject: Insulating layer
To: Magee, Andrew P; technet
Anyone,
We have an application on a 2 layer board with through hole
technology which requires an insulating material
laminated/applied to one surface/side. Initially we thought
of having a prepreg material laminated to one surface but are
unsure if this is the most cost effective method. Anyone out
there who knows of a method or material which would support
this requirement please respond.
Some of our requirements are;
1. Must be a UL recognized material
2. Must provide at least 500V of dielectric insulation
3. Would preferably be thin, .001-.003 thick.
Some questions we have are;
1. What type of relief would be needed around PTH?
2. How thick would the material need to be?
3. Who is doing this type of fabrication today?
4. Can it be applied selectively?
5. What is the typical cost impact to a double sided board?
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|