TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Magee, Andrew P" <"andrew.p.magee"@rogers-corp.com>
Date:
Fri, 01 Nov 1996 07:57:00 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (93 lines)
---------------------------- Forwarded with Changes
---------------------------
From: dhickey::(DHICKY) at ~FABRIK
Date: 11/1/96 4:32AM
To: Andrew P Magee at Rogers-MCD
*To: 27=technet::[log in to unmask]::25=SMTP  at ~FABRIK
Subject: Insulating layer
----------------------------------------------------------------------
---------
     From the world of flex circuits.........
     We routinely encapsulate circuits using an adhesive covered 
     polyimide coversheet. These materials can be punched or 
     drilled to match any pattern of openings that you require 
     and laminated to the board as a sheet or pieces. 
     
     Typically the adhesive is 0.001" and the polyimide is 
     0.0005", 0.001", 0.002", 0.003" or 0.005". The polyimide 
     provides >7000 V/mil and the adhesive gives >3500 V/mil 
     dielectric strength. 
     
     Our R/flex 2005 system is listed as UL94 V-0, 105C 
     continuous operating temp., and also carries the Delta mark 
     for use up to 120V and 15A.
     
     
     Andy Magee - Applications Engineer
     Rogers - Circuit Materials
     Tel: (602) 917-5237
     Fax: (602) 917-5256
     E-Mail: [log in to unmask]
     Website: http//www.rogers-corp.com/cmu
     
     ////////////////////////////
     //  SERVICE TO THE LINE,  //
     //  ON THE LINE,          //
     //  ON TIME.              //
     ////////////////////////////

     


______________________________ Forward Header
__________________________________
Subject: Insulating layer
Author:  dhickey::(DHICKY) at ~FABRIK
Date:    11/1/96 4:32 AM


From: [log in to unmask]
Date: Fri, Nov 1, 1996 4:32 AM
Subject: Insulating layer
To: Magee, Andrew P; technet
     
     
     Anyone,
     
     We have an application on a 2 layer board with through hole 
     technology which requires an insulating material 
     laminated/applied to one surface/side. Initially we thought 
     of having a prepreg material laminated to one surface but are 
     unsure if this is the most cost effective method. Anyone out 
     there who knows of a method or material which would support 
     this requirement please respond.
     Some of our requirements are;
     
     1. Must be a UL recognized material
     
     2. Must provide at least 500V of dielectric insulation
     
     3. Would preferably be thin, .001-.003 thick.
     
     Some questions we have are;
     
     1. What type of relief would be needed around PTH?
     
     2. How thick would the material need to be?
     
     3. Who is doing this type of fabrication today?
     
     4. Can it be applied selectively?
     
     5. What is the typical cost impact to a double sided board?
     

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2