We are experiencing sporadic dry film breakdown using Dynachem HG 2 mil
film. The laminators have
been thoroughly checked out so we don't suspect them and. The problem we are
seeing is what looks
like a seeping under the film in copper plating. When the panels are
completed the traces are
somewhat irregular and not as crisp edged as normal. What is frustraing is
that this happens so
sporadically and may only affect a couple of panels out of a long run or all
panels in a short run.

Any suggestions would be greatly appreciated.

Jim Moritz
ES&D

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