Eugenio and fellow Technetters:

Status of draft IPC Documents:

IPC-2225: Sectional Design Standard for Organic MCM-L & MCM-L Assemblies

IPC-6015: Qualification & Performance Specification for Organic MCM-L 
Mounting & Interconnecting Structures

Both are entering first proposal stage this month.

By ~ mid-1997 they should be available for purchase.

IPC-MC-790: Guidelines for Multichip Module Technology Utilization is 
currently  available from IPC ($35 members/$70 non-).


Hope this helps.

Doug Sandvick
(new) IPC Technical Project Manager (assembly)
[log in to unmask] 





On Wed, 7 Aug 1996, John Gully wrote:

> Eugenio,
> 
> As written earlier, I highly recommend Multichip Module Design, 
> Fabrication and Testing from Licari (McGraw Hill, 1800 2624729).
> Of several literatures and books I have read and put to use, this
> is sure to teach you the basics on MCMs (Multi Chip Modules).  
> However, the -L is an MCM constructed of Laminates and the -C is 
> constructed of Ceramics.  And then you have MCM-Ds which are THIN 
> FILM DEPOSITED,  very similar to wafer fabrication.  MCMs are used
> in several package types TAB (Tape Automated bonding) and COB 
> (Chip on Board).
> 
> Regards,
> 
> John Gulley - Process Engr
> Compuroute Inc.
> Dallas, TX
> 
> 
> 
> 
> 
> 
> 
> 
> 
> 
> > From:          [log in to unmask]
> > Date:          Wed, 7 Aug 96 09:33:05 EDT
> > To:            [log in to unmask], [log in to unmask]
> > Subject:       Re: GEN: Electronic Component Packaging Specs.
> 
> > Eugenio,
> > 
> > MCM stands for Multi Chip Module which is a high density packaging and 
> > interconnect approach.  the -L and -C stand for the type of substrate.  I 
> > believe -L is organic, -C is non-organic.
> > 
> > IPC-MC-790 Guidelines for MultiChip Module Technology Utilization is a good 
> > place to start.
> > 
> > Jeff 
> > 
> > ***************************************************************************
> > * TechNet mail list is provided as a service by IPC using SmartList v3.05 *
> > ***************************************************************************
> > * To unsubscribe from this list at any time, send a message to:           *
> > * [log in to unmask] with <subject: unsubscribe> and no text.        *
> > ***************************************************************************
> > 
> > 
> 
> ***************************************************************************
> * TechNet mail list is provided as a service by IPC using SmartList v3.05 *
> ***************************************************************************
> * To unsubscribe from this list at any time, send a message to:           *
> * [log in to unmask] with <subject: unsubscribe> and no text.        *
> ***************************************************************************
> 
> 

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************