Subject: | |
From: | |
Date: | Fri, 19 Apr 96 08:16:08 CST |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
HI,
YOU HAVE NOT STATED WETHER THIS IS A SMT OR THROUGH HOLE
COMPONENT, PRIMARY OR SECONDARY SIDE OR THE SOLDERMASK THICKNESS.
THAT HAVING BEEN SAID A GOOD RULE OF THUMB WE'VE BEEN USING FOR YEARS
IS NO LESS THAN .025'. THIS ALLOWS FOR A .005" ANNULAR SOLDER MASK
CLEARANCE AROUND THE PAD LEAVING .015" SOLDER MASK DAM BETWEEN PADS.
DEPENDING ON THE TYPE AND THICKNESS OF YOUR SOLDER MASK YOU CAN GO
SMALLER. SOME TIMES GOING SMALLER CAUSES THE SOLDER MASK TO DRAW AWAY
FROM ITS SELF, LEAVING A DASHED PATTERN OF SOLDER MASK BETWEEN THE
PADS. THERE IS AN IPC SPEC ON SOLDER MASKS OUT THERE, BUT I DON'T
HAVE IT READY TO HAND. GARY, CAN YOU HELP OUT HERE?
REGARDS,
ROB BUTTERWORTH
SR PWB DESIGNER
ADC VIDEO SYSTEMS
999 RESEARCH PARKWAY
MERIDEN, CT. 06455
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: FAB:ASSY:pad spacing
Author: [log in to unmask] at internet-mail
Date: 4/18/96 10:26 PM
Typically, what is the minimum spacing between printed circuit solder
pads that would allow for enough LPI soldermask to prevent bridging
for a wave soldering process ?
Is there a design guideline that specifically addresses this ? If so,
can you point me in the right direction.
Any assistance would be greatly appreciated.
Thanks
|
|
|