TechNet members with good memories -

In the ancient history of circuit boards, we called a defect
"hole-wall-pull-away" or "resin recession"  depending mostly if you were an
electroless vendor (then it was always resin recession) or if you were a
laminate supplier (then it was always hole wall pull away).  I see in the
interim final of IPC-6012 that the pseudo-defect? is now called "hole wall
dielectric/plated barrel separation".  For all three classes of boards in
section 3.6.2.1 on Plating Integrity/Table 3-8 the statement reads
 "Acceptable provided dimensional and plating requirements are met."

I recall the attitude change to cautious acceptance of limited
hole-wall-pull-away/ resin-recession, but I need help on how this was
documented with past spec revisions. 

Can anyone help me with this evolution as an overseas customer making boards
to older IPC specs wants to know.  Thanks

Denny Fritz
MacDermid - Waterbury, CT

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