The proliferation of sub .5mm peripheral leaded SMD's is causing
       assembly people to look at the overall size relationship
       between the master data and the actual board. When solder paste
       is stenciled on larger boards (say, 12-16"), the stencil image
       many times will not match the land pattern, causing shorts in the
       fine pitch area.
       My question:
        How much growth (or shrink) should one expect land-to-land over
       a 16" distance? This has nothing to do with drilling; just master
       pattern to actual board size...
       Thanks,

           marko