Address,
     
     Years back I bought and thoroughly read a Round Robin Study on 
     Accelerated Aging for Solderability Evaluations (IPC-TR-464), but 
     it was published back in 1984.  Although technologies have changed, 
     the medium in which they are connected has not made such strides.  
     
     My questions are: 
     
     Has IPC-TR-464 been superceded or re-written?
     
     Has much changed from the rewrite and the 1984 version?
     
     Aside from a few industry changes in how specs are called out, can I 
     still count on the intent and main contents of the evaluation?
     
     In addition to these questions, how can I obtain a list of current 
     Round Robin studies, the availability and cost.
     
     Please advise.  Thank you.
     
     John Gulley
     

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************