Your inquiry regarding 'Paste in Hole' for mixed technologies can be
addressed on two levels: (1) Reliability concerns for plated-through vias
(PTVs) that only obtain a partial filling of solder during reflow, and (2)
soldering through-hole components using a reflow process, rather than manual
soldering.  
I give a one-day workshop "Design, Manufacturing and Reliability Issues of
Plated-Through-Holes and Vias Through Design and Manufacturing" in which the
reliability issues for PTHs and PTVs are addressed, including the effects on
partially filled PTVs and the severity of manual soldering on PTHs and PTVs.
 
If your concern is the processing of (2) above, the response from Bob Willis
may address your needs.

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945
Phone & Fax: 201-543-2747
E-mail: [log in to unmask] 

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