Address,
     
     I'm in the process of designing a Adapter substrate similar to a LCC 
     device.  The connection will be made to a SMT land pattern for a 
     Lattice J-leaded package.   
     
     The connection point on the adapter substrate has a radii of .012 or a 
     a land width of .024.  
     
     Q:  Per IPC-SM-782, the width of the LCC connection can be .010 larger 
         than the corresponding land.  I'm I reading this correctly, if so,
         can I apply the same specifications to a substrate adapter?
     
         IPC-SM-782, section 12.3
     
     Please advise.  Thank you in advance.
     
     John Gulley - QA
     INET Inc.
     972-578-6100
     [log in to unmask]
     

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