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Address,
I'm in the process of designing a Adapter substrate similar to a LCC
device. The connection will be made to a SMT land pattern for a
Lattice J-leaded package.
The connection point on the adapter substrate has a radii of .012 or a
a land width of .024.
Q: Per IPC-SM-782, the width of the LCC connection can be .010 larger
than the corresponding land. I'm I reading this correctly, if so,
can I apply the same specifications to a substrate adapter?
IPC-SM-782, section 12.3
Please advise. Thank you in advance.
John Gulley - QA
INET Inc.
972-578-6100
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