Hello Gary,

Thanks for the response. Just one quick point about edge plating. By partially 
routing the  profile at the first drill stage, the panel is kept intact until 
the final profile. The number of attachments between individual pwb's will 
depend on board size, laminate thickness, and rigidity required for processing. 
You could probably have up to 90% of the edge plated with the remainder being 
taken care of with vias.

Another problem with vias for screening is that they sometimes escape the 
standard spacing requirements for through holes and inner layer copper causing 
violations of manufacturing rules for the fabricator. This may be because they 
tend to be added after board design as an afterthought or to fix a problem.

In your message dated Thursday 24, October 1996 you wrote :
>      I agree, edge plating is electrically probably much better than vias 
>      but I think boards would have to be singulated before plating.  If 
>      your boards are going to be assembled as multi-up panels you will 
>      probably be stuck with using vias.

Paul Gould
EMail [log in to unmask]

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