TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Date:
Thu, 15 Feb 1996 14:00:50 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines)

Raj,

We have many customers (AT&T, Apple, IBM, Motorola, etc.)
 who would be happy to help you understand the cost vs benefit ratio
for nitrogen in convection reflow.  It depends a great deal upon your
components and paste.  The finer the pitch (less than 20 mil) and the
lower the solids paste (5% and less), the lower the oxygen level you
want to have to get good soldering.

Give me a call if you'de like and I can put you in touch with users
processing similar parts to you.

Mark Nowotarski
Manager, Advanced Soldering Development
Praxair Inc.
Tarrytown NY USA
tel 914 345 6452



ATOM RSS1 RSS2