TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Date:
Wed, 16 Oct 1996 12:51:06 -0500 (EST)
Content-Type:
TEXT/PLAIN
Parts/Attachments:
TEXT/PLAIN (20 lines)

Do any of you know of or have a checklist (at a high level) of what should
be investigated if solder balls left on PCB assemblies after reflow?  What
is typically the most common cause that should be investigated first?

Thanks,

Tom Olafsson
Teradyne Inc.
[log in to unmask]

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2