We have a customer that is experiencing problems with chip components; the
ceramic is separting from the end termination metalization. The board is
thin at .031" and the problem occurs when the board flexes. All chip
metallization remains embedded in the solder fillet and the ceramic body
pulls away. Dialog with their component source says to stiffen the board so
it doesn't flex, but these folks are aware of placing components on much
less rigid flex print, and aren't familiar with resultant component damage
in that process.

They are examing the possibility to move to a thicker board, but in the
meantime just looking for a spec/guideline that will tell them how securely
attached the end metalization should be on a chip resistor.

Suggestions?

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