We have a customer that is experiencing problems with chip components; the ceramic is separting from the end termination metalization. The board is thin at .031" and the problem occurs when the board flexes. All chip metallization remains embedded in the solder fillet and the ceramic body pulls away. Dialog with their component source says to stiffen the board so it doesn't flex, but these folks are aware of placing components on much less rigid flex print, and aren't familiar with resultant component damage in that process. They are examing the possibility to move to a thicker board, but in the meantime just looking for a spec/guideline that will tell them how securely attached the end metalization should be on a chip resistor. Suggestions? ***ALL NEW EMPF PHONE NUMBERS*** Jack Crawford HelpLine Manager Electronics Mfg. Productivity Facility ****NEW--317.655.3688--NEW**** *****FAX 317-655-3699 NEW **** 714 N Senate Ave, Suite 100 Indianapolis IN 46202-3112 VISIT OUR HOME PAGE AT: http://www.empf.org [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************