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1996

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Subject:
From:
"Greg Bartlett" <[log in to unmask]>
Date:
6 Nov 1996 08:47:36 -0400
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                      RE>>OSP Coating                              11/6/96

Lothar,
Our Workmanship Standards are essentially IPC 610, Class 2, Rev B, but we've added a   waiver to address the lack of a "sufficient" top-side through hole fillet.  Rev B is a bit more generous than was Rev A in this respect, but the waiver is still needed.  

Regards,
Greg B.   

--------------------------------------
Date: 11/6/96 4:10 AM
To: Greg Bartlett
From: Thole, Lothar
Greg Bartlett of Mercury Computer Systems wrote:

<stuff deleted>

For what it's worth:  our products are generally double-sided SMT or 
mixed =
technology, they're assembled with water soluble chemistries, and the =
final applications are mainly in high performance defense and medical =
markets.

<stuff deleted>

My question is: When using OSPs with mixed technology, how is the issue 
of hole fill and top-side wetting of the annular rings addressed?

Regards,
Lothar Thole
QPSX Communications Pty Ltd
33 Richardson Street
West Perth  WA  6005  Australia
Tel: +61-9-262-2000
Fax: +61-9-324-1642
email: [log in to unmask]



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Date: Wed, 06 Nov 1996 16:10 WAT
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Subject: Re: OSP Coating
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