I would concur that TM 2.4.36 has temperatures that are well below the
accepted use temperatures currently in general use.  On a normal double sided
boards we normally recommend temperatures of 600-650 degrees F.  Thermal
planes may require a slightly higher temperature - up to around 700 - 725).

IMHO, all that this test will demonstrate if followed to the letter (note para.
5.1.6) is a very poor PTH and not much else.  As far as testing how robust a
board might be, I don't think that this test goes nearly far enough.  In the "real
world" the operator is going to contact the terminal land and is likely to apply
pressure as well.

--
-------------------------------------------------
  David E. Robertson
  Corporate Training Administrator

  PACE Incorporated --
    e-Mail:  [log in to unmask]
  URL http://www.pace-solder.com/info/
-------------------------------------------------

OR

--
-------------------------------------------------
  David E. Robertson
    e-Mail:  [log in to unmask]
  URL http://www.clark.net/pub/drbtson/

  PACE Incorporated --
    e-Mail:  [log in to unmask]
  URL http://www.pace-solder.com/info/
-------------------------------------------------




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Posted: Mon, Jul 15, 1996  11:53 AM EDT              Msg:
VVJG-5348-2802/20
From:   ("RFC-822": <TechNet-request(a)ipc.org>,
SITE:INTERNET)
Subj:   ASSY: Rework Simulation Test
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IPC-TM-650 Method 2.4.36 Rework Simulation, Plated
Through Hole calls
for unsoldering and resoldering a wire in a plated
through hole 5 tiimes
using a 60 w. soldering iron set at 450 to 500 deg. F.
This soldering iron
temperature requirement seems very low to me and
doesn't fit actual
practice in industry. Is there something I'm missing?
Does anyone know
why the temperature is required to be at 450 to 500 F?

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