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Subject:
From:
JIM ENNIS <[log in to unmask]>
Date:
Mon, 18 Nov 96 16:03:00 PST
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Looking to find out how much a standard LPI (epoxy) soldermask inhibits the 
transfer of heat from a hot IC to a ground plane under this IC.  Can anyone 
out there tell me whether it would be better to leave this ground unmasked?

Thanks in advance.

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