Second European Surface Mount Conference
12-14 November 1996 Old Ship Hotel Brighton UK
"Sharing in the advancement of the electronics manufacturing industry"
An event organised by The SMART Group
Further details are available by contacting:
Tony Gordon
The SMART Group
86 Easton Street
High Wycombe
Buckinghamshire HP11 1LT
UK
Tel:+44 (0) 1494 465 217
Fax:+44 (0) 1494 473 975
Email: [log in to unmask]
This conference is a must for companies associated with electronics assembly
wanting to keep abreast of the latest manufacturing developments, and requiring
to improve the efficiency of their processes and the reliability of their
products.
In addition to a conference programme that includes experts from around the
world, the event has workshops and a trade table-top exhibition. There are also
a number of social times, to enable delegates to exchange views and ideas
informally.
This is undoubtedly "The European Event of 1996" and not to be missed.
THE EVENT
Session A
ENVIRONMENTAL DRIVERS IN ELECTRONICS MANUFACTURING
Wednesday 13 November 08.30 - 12.00h
Environmental management in electronics manufacturing
Brian Richards GEC Hirst Research, Borehamwood, UK
Electronics manufacturing companies are being subjected to increasing pressure
to reduce their environmental impact. This talk will show how companies, large
or small, can benefit from planning and designing products and processes to meet
ever-tightening regulations on VOCs, water effluent, energy use, hazardous
materials and recyclability.
Electronics recycling policy & practice
Claire Snow ICER, London, UK
Electronics products are a prime target for recycling regulations. Six million
consumable items are disposed of annually in the UK. ICER (Industry Council for
Electronic Equipment Recycling) is the focal point for the industry, to
influence the European Union regulations and to help set up an infrastructure
for recycling in the UK.
Getting ready for lead-free solders
Ning-Cheng Lee
Indium Corporation, Clinton, New York
A worldwide abandonment of lead-containing solders very nearly happened in 1994.
It was temporarily held in abeyance only by the Republicans taking control of
the US Congress. All the large companies have a strategy to deal with the issue
when it resurfaces. Do you know how it will affect you and what the options
are?
The impact of changing your cleaning process
David Andrews
GEC Hirst Research, Borehamwood, UK
You may not be using ozone-depleting solvents now, but alternative cleaning
processes bring their own environmental and control problems, such as monitoring
of aqueous discharges, possible restrictions on use of HFCs and PFCs, and health
& safety of operators. This talk will give practical help and advice,
illustrated by real case studies.
Achieving environmental accreditation: BS7750, EMAS, & ISO14001
Phil Hamilton
D2D, Kidsgrove, Staffordshire, UK
This presentation is based on experiences from piloting and achieving BS7750
environmental accreditation, followed by registration to EMAS and certification
to ISO 14001. It will deal with the motivation for accreditation, hints and
tips for success, and the costs.
Session B
MATERIALS FOR THE FUTURE
Wednesday 13 November
13.30 - 17.00h
No-clean solder pastes for high-speed fine-pitch printing
Malcolm Warwick
Multicore Solders, Hemel Hempstead, UK
`Fine pitch' and `high-speed' printing are major goals for process improvement.
This talk will present work to understand and optimise the solder paste rheology
to meet these goals. Results will be related to user experiences on volume
production processes.
Characterisation techniques for soldering fluxes
Laura Turbini
Georgia Tech, Atlanta, Georgia
In recent years there have been many new and interesting flux formulations,
offering either improved performance or reduced environmental impact. A
re-examination is required of test methods to understand and evaluate
interactions between the flux and the solderable pads and substrate. This talk
will discuss the use of SIR, corrosion tests, and impedance spectroscopy.
New laminates for future PCBs
Manfred Huschka
Allied Signal, Wipperfuerth, Germany
Fire-resistant glass-fibre reinforced epoxy laminate, FR-4, has been the
mainstay of high-reliability circuit boards for decades. The time has come for
its universality to be challenged. The change is being driven by greater
requirement for dimensional stability, higher operating temperatures, and
recyclability.
Conductive adhesives: the way forward
Russ Miculik
Alpha Metals, Jersey City, New Jersey
What is happening with conductive adhesives? For many electronics assembly
applications, conductive adhesives are a viable cost saving alternative to
solder. Assembly processing can be much simpler and process control less
stringent. But how do I get started with this technology? What are the pitfalls
and the advantages? What are the long term reliability data?
Screen-printable adhesives for surface mounting
Anne van den Bosch
Grace NC, Westerlo, Belgium
Are you planning to screen print adhesives? You must know how to specify the
stencil, evaluate suppliers of adhesives, and optimise your printing process
parameters.
Session C
QUALITY & RELIABILITY
Thursday 14 November
08.30 - 12.00h
The influence of solderability on reliability
Chris Hunt
National Physical Laboratory, Teddington, UK
Martin Wickham
Surface Mount Club, Teddington, UK
Solder interconnects fail in service by thermal fatigue. Fatigue resistance is
dependent upon solder fillet shape which in turn is dependent upon component
solderability and the soldering process. Reliability data will be presented
that relate these parameters in a quantitative manner, to be used predictively.
Predicting solder joint reliability
Rob Wallach
Cambridge University, UK
Fatigue resistance of solder joints depends on component geometry, leadframe &
pad materials, fillet shape and solder microstructure. The variables are too
many for adequate prediction of reliability to be made from experimental
measurement alone. An understanding of failure mechanisms plus predictive
computer models are required.
SIR: Assessing product reliability
Doug Pauls
Contamination Studies Laboratories, Kokomo, Indiana
The measurement of surface insulation resistance (SIR) is the only conceivable
means of predictively relating the assembly process parameters to in-service
product reliability. This presentation will cover all the commonly asked
questions about SIR: Why are so many SIR test procedures in use? What are the
moves to standardise the test? Why cannot the test be shortened? How do I
relate the SIR measurement to in-service reliability?
Is a cleaned assembly more reliable?
Bill Kenyon
Global Center for Process Change, Montchanin, Delaware
With the abandonment of traditional de-fluxing solvents CFC-113 and
1,1,1-trichloroethane, no-clean fluxes and no-clean processes have become
common. New solvents and new cleaning technologies are now appearing that
enable the cleaning issue to be revisited, especially the implications to
reliability.
Design for reliabilityRory Doyle
NMRC, Cork, Ireland
"Design for manufacturing", "Design for success". These are some of the buzz
phrases of our industry. A design must simultaneously take into account all
aspects of required funcionality, thermal management, and mechanical robustness,
to ensure a reliable product.
Session D
STATE-OF-THE-ART MANUFACTURING
Thursday 14 November
13.30 - 17.00h
Fluxless soldering under plasma
Denis Verbockhaven
Air Liquide, Paris, France
Reliable, inexpensive, high throughput fluxless soldering of electronics is the
elixir to be found. This paper presents a positive step towards that goal,
describing a radically different approach to inert atmosphere and plasma
systems. It operates at atmospheric pressure, is easy to implement and
maintain, and completely does away with the need for chemical flux.
Reliable processing of BGAs and flip-chips
Gunter Schiebel Siemens, Munich, Germany
BGAs have become the established way forward to increase functionality and the
number of I/0s, without further reducing track pitches. BGAs have their own set
of problems which many companies have overcome reliably, in terms of machines
for placement, reflow processing and inspection.
Leading-edge technology in high-volume manufacturing
Irene Lee Seagate Technology International, Singapore
Leading-edge advances in manufacturing, such as ultra-fine pitch, very high
pin-counts, grid-array components, and chip-on-board, are developed originally
for low volume niche applications. The true test of feasibility of a technology
comes when it is implemented at high yield in high volume consumer products.
Tomorrow's packaging: chip scale versus flip-chip
Katarina Boustedt
IVF, Gothenberg, Sweden
New component packages are thrust upon the hard-pressed production engineer to
assemble with zero defects. What lies ahead for component packages? And what
will be the driving forces for change?
Trends in electronics assembly processes
Martin Verguld Philips, Eindhoven, Netherlands
The state of the art in fine-pitch capability is moving towards 0.3mm pitch: the
necessity and ability of automated inspection of paste deposition will be
discussed. Examples will be given of the processing problems of area-array
packages, as well as the
Workshop W1
DESIGN FOR MANUFACTURE
Wednesday 13 November
08.30 - 12.00h
A team from:
D2D, Kidsgrove &
Zuken-Redac, Reading
Course Objectives
Good design can save you money.
Poor design will cost considerably more, but worse, will delay you getting
product to market.
This course will provide a better understanding of the practical aspects of
"Design for Manufacture". All design and process engineers must consider if a
product can be manufactured at the correct yield. Procurement engineers must
consider if the specification for the materials is suitable.
Workshop Content
Design considerations, the implications of good or bad design, and rules &
recommendations for design will be addressed for the following topics:
.Board size & panelization
.Tooling holes & fiducials
.Pad sizes
.Pad & component spacings
.Double side components
.PCB finishes
.Solder mask
.Through hole / track sizes
.Via hole sizes
.Silk screen
.Component packaging
.Component specification
.Test pads
Practical solutions will be offered to real design-related problems. You are
invited to bring your own parts or boards for discussion.
Who Should Attend
The course is suited to all involved in electronics manufacture, especially
designers, process engineers, quality management, purchasing staff and
supervisors.
Instructors
The instructors are a partnership of leading companies in electronics
manufacturing and in CAD. They come with a wealth of experience of optimising
soldering processes, analysing and understanding manufacturing defects, and
feeding back this information to the design team.
Workshop W2
TROUBLESHOOTING THE REFLOW SOLDERING PROCESS
Wednesday 13 November
13.30 - 17.00h
Ning-Cheng Lee
Indium Corporation, Clinton, New York
Course Objectives
This course will provide users with a thorough understanding of modern reflow
soldering processes for surface mount technology, including ultra-fine-pitch
(UFP) and ball grid array (BGA) applications.
The course will provide the ability to:
Understand the principles of soldering, fluxes, and solder paste technology
Select the adequate soldering technology for your specific application
Select the appropriate equipment for the soldering process
Determine and conduct the pertinent testing methods for soldering materials
evaluation
Comprehend various types of problems encountered during soldering
Understand the reasons for, and mechanisms of those problems
Identify the exact causes of problems encountered Determine the approaches to
eliminate or to prevent the problems
Design and organise the soldering processes to maximise the output
Most importantly, this course will enable the users to determine the best
options for solving and preventing the problems, and consequently to achieve a
trouble-free reflow soldering process.
Workshop Content
Status and trends of surface mount technology
Fundamentals of solders and soldering
Basic modern flux chemistries
Soldering process practice, including processing technologies, equipment design
principles, and optimisation of processing parameters
Mechanisms and solutions for problems at or after the reflow process, including
dewetting, leaching, tombstoning, skewing, wicking, bridging, voiding, white
residues, intermetallics, solder balling, solder beading, fillet lifting, and
dendritic growth.
Who Should Attend
This course is intended for engineers, supervisors, managers, scientists,
technologists, and technicians who are constantly plagued by the varieties of
problems occurred in SMT reflow soldering processes. The information provided
is critical for those who are responsible for designing assemblies, for
selecting soldering processing equipment, and for selecting and processing
solder pastes and fluxes.
Instructor
Dr Ning-Cheng Lee is the Director of Research and Development of Indium
Corporation of America. He has very extensive experience with the development
of materials and processes for solder assembly.
Workshop W3
RELIABLE MANUFACTURING WITH BGAs
Thursday 14 November
08.30 - 12.00h
Marie Cole
IBM, Hopewell Junction, New York
Course Objectives
After completing this course you will be able to:
Recognise the advantages and disadvantages associated with various
BGA designs
Understand the BGA assembly process and tooling considerations
Identify the parameters that influence the reliability of the ball array joint
Determine key considerations for rework of different BGA packages
Ball grid array packaging has exploded onto the surface mount scene with a
rainbow of options. Offerings range from plastic, to ceramic to tape. Both
flip-chip and wirebond devices are available in BGA formats. Why so much
enthusiasm? The BGA packages combine excellent package performance with high
I/O density without the demand of fine pitch assembly. Standard pitches on
array products are 1.5mm, 1.27mm and 1.0mm allowing assembly using standard
surface mount equipment and processing with very high yields. Like any new
technology, using BGAs requires an investment in learning and understanding how
best to implement them into the product and assembly line.
Workshop Content
This workshop will walk through the many questions posed by using various BGA
packages, and offer some comparisons of the unique challenges posed by each
package type.
Topics include:
What is a Ball Grid Array package
Comparisons of various BGA designs
Card design considerations
Thermal management
Reliability considerations
Assembly (SMT) process controls
Compatibility of BGAs with total boardc requirements
Rework challenges
Industry Trends
Who Should Attend
This workshop is for those who anticipate implementing BGA packages into their
product designs or into their SMT assembly lines. It is suitable for process,
product and development engineers.
Instructor
Marie Cole is an advisory engineer with IBM Microelectronics. From 1984 to 1988
she worked in Product Assurance, testing and qualifying the first SMT packages
used by IBM. Since 1988, she has worked on the development of ball and array
packaging. Her current assignment is in New Product Applications.
Workshop W4
PRACTICAL QUALITY CONTROL IN SURFACE MOUNT
Thursday 14 November
13.30 - 17.00h
Bob Willis
Electronic Presentation Services, Chelmsford, Essex
Includes a FREE PPM-monitoring kit for each participant.
Course Objectives
To identify materials properties, process parameters and component failure modes
that affect the quality of surface mount assembly operations. Then examine how
these variables can be controlled with proper design, specification, incoming
inspection and process monitoring.
Inspection criteria will be discussed along with the most effective way of
training staff to monitor the inspection process. During the workshop a quality
control system will be illustrated to aid effective process control and meet
customer audits to ISO9000. The session will also provide practical solutions
to your SMT problems with a "Defect Clinic" to solve your board assembly
problems.
Each participant will receive a free Process Monitoring Kit comprising
spreadsheets and graphs for use on Excel, and instructions on how to use them
for monitoring.
Workshop Content
. Materials requirements
. Printed board specification
. Solder pastes
. Adhesive evaluations
. Component packaging requirements
. Manufacturing quality control &
inspection standards
. Goods receipt inspection
. Assembly
. Soldering
. Inspection documentation
. PPM process monitoring
. Process problems & solutions
. Adhesive contamination
. Solder paste slump
. Reflow soldering shorts & opens
. Wave soldering shorts & skips
. Component failure modes
. Soldering standards
. Defect analysis
Who Should Attend
The course is suited to all those involved in the use of surface mount
technology; in particular those engineers tasked with the introduction of
quality improvement, and quality engineers undertaking process control
measurements and setting manufacturing standards.
Instructor
Bob Willis operates Electronic Presentation Services, a training and consultancy
company. He has practical experience of all aspects of electronics
manufacturing, and is in demand as a leader of training programmes, courses and
workshops.
Special Workshop SW1
ENTRY-LEVEL SURFACE MOUNT:
A multi-company, hands-on event
Wednesday 13 November, from 10.00h
Thursday 14 November, from 08.30h
(semi-continuous presentations)
Peter Marshall
DEK - Albany, Weymouth
Scope of the Workshop
The workshop will cover the following topics:
. Introduction to SMT (video)
. Solder pastes / Adhesives (Multicore)
. Screens / Stencils / Printing (DEK)
. Components (Flint)
. Placement / Reflow (Albany)
. Inspection / Rework (ART)
Format
Each topic will be covered (in about 40 minutes) by a presentation followed by a
demonstration and the opportunity for participants to gain "hands-on"
experience.
The presentations will be run semi-continuously. Exact start times of each
presentation will be posted at the hotel. This will enable delegates to mix and
match with the other events.
Who Should Attend
Production staff, production managers, designers, quality managers, and any
technical staff making decisions about products, manufacturing and purchasing,
from companies that are thinking about starting up, or have just commissioned, a
surface mount manufacturing facility.
Instructors
Peter Marshall has organised many multi-company display production lines at
exhibitions and at workhops of this kind. The equipment will be the most modern
available for small-scale production and all the speakers and demonstrators will
be very well experienced at training.
Special Workshop SW2
USING THE INTERNET TO YOUR ADVANTAGE
Wednesday 13 November
17.00h
Paul Barlow
Vertical Marketing, Wimbourne
Objectives
Electronic networking can be of real benefit to the bottom line of your company:
for marketing, for benefitting from others' experiences to solve your technical
problems, for recruiting staff, for keeping abreast of technical and business
issues. It is both inexpensive and cost effective.
This workshop will show you how to get started; how easy it is. You will be
introduced to many of the opportunities that are open to you.
There will be practical demonstrations and an opportunity for you to try it for
yourself. Details will be given of Bulletin Boards and pages on the WWW
specifically for electronics manufacturing.
Who Should Attend
Everyone who wants to be part of a company operating in the 21st Century.
Instructor
Vertical Marketing is one of the UK's leading exponents of helping companies
benefit from the electronic networking. It has special expertise in
appreciating the opportunities for the electronics manufacturing sector.
Special Workshop SW3
CONTRACT MANUFACTURING CHALLENGES: A discussion
Wednesday 13 November
17.00h
Brian McKandie
Hewlett Packard Espanola, Barcelona
Background
Contract manufacturing is a huge ($12B) activity, projected to grow at 20-40%
pa. Is your company exploring this option?
Format
A presentation will be made from a USER's point of view, covering the strategic
options in selection of CM partners: including technology, cost and geographic
location. This will provide the basis for open discussion on future challenges
and the best way the OEM/CM partnership can meet them.
Who Should Attend
OEMs, process & test equipment providers, consumable providers and the Contract
Manufacturers themselves.
Facilitator
Brian McKandie is a procurement specialist with Hewlett Packard, responsible for
establishing and managing relations with contract manufacturing partners.
Hewlett Packard is a major user of contract manufacturing services worldwide.
Details circulated by Bob Willis, Conference Committee
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