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Subject:
Outgassing causing solder balls
From:
"Crawford, John A." <[log in to unmask]>
Date:
Tue, 06 Feb 96 09:48:00 EST
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>From the EMPF Helpline in Indianapolis:  Looking for information regarding 
solder balls or solder "burping" during a soldering process due to 
outgassing.  The outgassing is theorized to be caused by organic inclusion 
from the board plating process.  The soldering process here is being done 
with a traditional solder pot soldering connectors to a standard FR-4 
substrate.

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