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| Date: | Tue, 29 Oct 96 21:54:16 PST |
| Content-Type: | text/plain |
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Hello all,
We are evaluating the assembly process for a 432 ball Super BGA (Ball Grid Array).
Is there anyone who can share assembly experience with this package family. I am interested if
anyone done measurements on how much the package collapse during reflow, problems with package
"tilting"?
Hans Bogren
Ericsson Telecom AB
E-mail; [log in to unmask]
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