Ted;

We build similar boards for some of our customers. I do not know of any
performance specification that covers voids on plated copper board edges. I
would suggest that you define your requirements on the master drawing. Your
definition would be based on design requriements, and I suspect they would
change with each application.



At 12:05 PM 5/16/96 -0500, Edwards, Ted A (AZ75) wrote:
>
>     We procure microwave boards that to IPC-HF-318 would be Class 3 Type 3. 
>  Recently we see some suppliers having problems which result in plating 
>voids.  The criteria for voids in a plated through hole are defined but 
>voids in the plated edges of the board do not seem to be defined anywhere.
>
>     Question 1.  A void across an interconnect in a normal multilayer is 
>real bad but what about a void across the same interconnect when it is a 
>ground that goes all the way around the periphery of the finished board?
>
>     Question 2. Does anybody know where plated edge requirements are 
>listed?
>     Question 3.  Since I can not find what I am looking for in a 
>specification, if no specification exists, does anybody have criteria?
>
>          Thanks
>               [log in to unmask]
>
>
Regards,

Gary Ferrari
Chairman IPC-D-275
Tech Circuits
(203)269-3311
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