Good day,
        We have encountered a low solder paste level in the printing
process.  We are using a Metal squeegee on a Metal Screen to print the
solder paste onto the PCB before SMT processes.  
        We were wondering whether the solder paste viscosity is too thick;
or there is a Stencil Design fault.  The SPC chart states the solder paste
thickness should be between 6.5 mil to 8.5 mil.  But we can only achieve
only up to 6.2 mil of solder paste thickness.  Our stencil is 6.0 mil in
thickness.
        Can anyone give me the specifications on the design of Metal
Stencils and give suggestions on how to solve the above problems? Thank you.

Regards,
Chan Yong Kwee
E-mail:[log in to unmask]
Tel    : (65) 746-6617
Pg     : 9-490-6514