I'd probably get a response if I included my email address, so here it 
          is:
          
          [log in to unmask]


______________________________ Forward Header __________________________________
Subject: ASSY: Whiskers on QFP's After Reflow
Author:  Greg Kilinski at BLDG-C
Date:    8/1/96 08:06 AM


          My subcontract assembler is experiencing whisker formation after 
          (convection) reflow soldering on 208 QFP packages. Eutectic solder 
          paste is used. I haven't performed XRF on the package nor the PCB, 
          but I suspect high Sn content. Any comments would be greatly 
          appreciated.
          
          Greg Kilinski
          Acuson Corp. 

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