I'd probably get a response if I included my email address, so here it is: [log in to unmask] ______________________________ Forward Header __________________________________ Subject: ASSY: Whiskers on QFP's After Reflow Author: Greg Kilinski at BLDG-C Date: 8/1/96 08:06 AM My subcontract assembler is experiencing whisker formation after (convection) reflow soldering on 208 QFP packages. Eutectic solder paste is used. I haven't performed XRF on the package nor the PCB, but I suspect high Sn content. Any comments would be greatly appreciated. Greg Kilinski Acuson Corp. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************