TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
[log in to unmask] (Tom-D Moore)
Date:
Fri, 10 May 96 10:37:48 BST
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines)
 Hi Steve,

	You may find that the low humidity will lead to a significant risk of 
	ESD damage to your parts, as well as rather uncomfortable working 
	conditions for your people.

	Richard L. Shook and co-workers published an excellent paper on 
	Moisture Absorption/desorption rates at last years ECTC:

Richard L. Shook et al: Diffusion Model to derate Moisture Sensitive Surface 
Mount ICs for Factory Use Conditions, pp440 - 449; 45th Electronics Components 
& Technology Conference, Las Vegas, 1995.

	His data is particularly valuable (and re-assuring)for operations in 
	which a bag is opened and closed daily, in which an effective dessicant 
	is included.

	I hope that this helps you.

	Tom Moore,
	Package Development, Analog Devices B.V., Ireland. 



ATOM RSS1 RSS2