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Date: | 24 Apr 96 13:13:00 -0500 |
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I am aware of the importance of a well controlled copper
oxidization process to promote good inner layer adhesion for
multi-layer PCB's. It has been brought to my attention that a weak
copper oxide layer (maybe the crystal structure is too long) may cause
electrical problems on the inner layers as the structure crumbles in
the lamination stages, possibly creating a time-bomb scenario with
shorts forming later when electrically stressed.
Has anybody out there experienced this phenomenon or do you know of
any articles or papers on the subject.
Regards Gary Willard
Motorola (UK)
E-mail [log in to unmask]
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