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1996

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Subject:
From:
Thomas Stewart <[log in to unmask]>
Date:
Thu, 2 May 1996 16:41:12 -0700 (PDT)
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Hi all,
Does anyone have experience with soldermask on teflon?

Is there any information or specification on acceptance criteria for 
bubbles in mask along traces for teflon material specifically?

We have very good adhesion, but on a random basis we will get very small 
(less than .005") hard surfaced bubbles. They will not propagate or break 
with heat.

We use a very gentle bake cycle -- 6 hours with 2 ramps, but the skin on 
the mask just will not allow all the volatiles to escape without causing 
the soldermask to bubble.


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Tom Stewart
Speedy Circuits                              Phone: 714-891-9441
5292 System Dr.                              Fax:   714-895-8485
Huntington Beach, Ca  92649                  Email: [log in to unmask]
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