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| Date: | Fri, 14 Jun 1996 14:14:06 +600 CDT |
| Content-Type: | text/plain |
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Address,
I am looking for sound information regarding the land pattern
of PBGA and CBGA components, specific to bareboard fabrication.
I have contacted several sources (Motorola, IBM, etc.) and looking
for more info. IPC-SM-782 does not cover this type of component
geometry. Has IPC developed or revised -782 to include BGA land
patterns? If so, I need a copy. All sources of information are
welcomed. Thank you.
John Gulley - PE
Dallas, TX
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