We have experienced dramatic yield improvements in SMT by 
     utilizing Nickel/Gold (2-6 micro-inches of Gold over 100 
     micro-inches of Nickel) instead of Tin/Lead(HASL) on our Printed 
     Wiring Boards.  Due to Mixed Technology Designs, several of these 
     Designs are processed through Wave-Solder.  We have experienced 
     the obvious, increased Gold contamination in the pot, but yields 
     have also increased. We have stepped-up Pot samples and Pot 
     changes to overcome this problem.
     
     Is anyone else processing Nickel/Gold plated Printed Wiring 
     Boards across Wave-Solder and have there been any problems other 
     then what I have listed above?
     
     Thanks for your time - Harlan