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18:09 1996 |
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We have experienced dramatic yield improvements in SMT by
utilizing Nickel/Gold (2-6 micro-inches of Gold over 100
micro-inches of Nickel) instead of Tin/Lead(HASL) on our Printed
Wiring Boards. Due to Mixed Technology Designs, several of these
Designs are processed through Wave-Solder. We have experienced
the obvious, increased Gold contamination in the pot, but yields
have also increased. We have stepped-up Pot samples and Pot
changes to overcome this problem.
Is anyone else processing Nickel/Gold plated Printed Wiring
Boards across Wave-Solder and have there been any problems other
then what I have listed above?
Thanks for your time - Harlan
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