I am in the process of upgrading SPC techniques to our facility. Was 
wondering if anyone would have any ideas on how to improve, measure 
and implement SPC techniques to the placement and  reflow processes.  
     
I did a lot of study on the printing process and I think with proper 
measurements of solder paste volume and stencil openings - problems 
like insufficient and bridging can be solved.
Your ideas, comments, advise on placement and reflow processes would 
be much appreciated.
     
Thank-you
     
     
Mohit Gujral
QA Engineer
Solectron
     
[log in to unmask]
     
Ph 408 957 2757
Fx 408 957 2645

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