Trevor,

  I would like to get a copy of whatever information you might have.

  Charles Barker
  Mfg. Engr.
  Input/Output, Inc.
  12300 Parc Crest Drive
  Stafford, Texas 77477

  713/276-3328 Voice
  713/240-7972 FAX
  [log in to unmask] e-mail

  Thanks.

  Charlie B.

  To:       Technet @ ipc.org
  cc:        (bcc: Charles Barker/IO-US)
  From:     TechNet @ ipc.org
  Date:     08/23/96 08:22:37 AM MST
  Subject:  Re: SPC Procedures





  Mohit,

  We have a 'Process Monitoring & Yield Improvement' kit that can be
  integrated into SPC systems. The kit comprises a set of spreadsheets
  measuring the different stages of the assembly process, a defect
  guide and full instructions on how to use the kit. There is also an
  optional diskette containing the spreadsheets on Lotus 123 and an
  instructional video.

  We also have a book publication entitled 'Manufacturing Techniques
  for Surface Mounted Assemblies'  which has a large section devoted to
  SPC.

  If you are interested further information on either of these
  publications, please send me your full address and fax number.

  Regards,

  Trevor Galbraith

  > Date:          Thu, 22 Aug 96 10:06:02 PST
  > From:          "MohitGujral" <[log in to unmask]>
  > To:            [log in to unmask]
  > Subject:       SPC Procedures

  > I am in the process of upgrading SPC techniques to our facility. Was
  > wondering if anyone would have any ideas on how to improve, measure
  > and implement SPC techniques to the placement and  reflow processes.
  >
  > I did a lot of study on the printing process and I think with proper
  > measurements of solder paste volume and stencil openings - problems
  > like insufficient and bridging can be solved.
  > Your ideas, comments, advise on placement and reflow processes would
  > be much appreciated.
  >
  > Thank-you
  >
  >
  > Mohit Gujral
  > QA Engineer
  > Solectron
  >
  > [log in to unmask]
  >
  > Ph 408 957 2757
  > Fx 408 957 2645
  >
  >
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