Date : 11/7/96 10:29
Msg From: S V C  PATRO
We have the following querries regarding the rework of BGA:

1. During removal of PBGA package having euctetic solder balls (dia
0.6 to 0.9mm) with 63/37 composition, what happens to the shape and
size of the solder ball.
2. Can the removed pbga be again soldered on the PCB.
  If yes, suggest the rework steps.
3. what standof has to be maintained for assembled PBGA package?
4. Also guide us to which inspection criteria/ standard is to be
folloewed.
5. In case of X-ray inspection, is transmission X-ray capable of
deflecting the solder defects (specially voids, and insufficient
solder)? 
If yes, what range of X-ray voltages to be applied for multilayer
PBGAs. what specification is to be followed?

Thanks in advance

Regards,

S V C patro
Altos India ltd
Gurgaon,
India
India


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