My company, like all others, is striving for zero defects in circuit board 
assembly and in what is shipped to our customer.  We are a medium volume 
shop, three lines, producing 10,000bds per day for the big Three.  We are 
using well known equipment, MPM printers, Camalot/Universal gluers, Fuji 
highspeed chip shooters, Electrovert ovens, and Electrovert/Seho wave 
solders(Seho are full tunnel), and Teradyne inline BON.  All products are 
EOL tested. We know that machine maintenance and operator training are 
major factors in reducing the defect rate, and programs are presently being 
put in place to address these areas.  We are curious where others have 
"process inspection steps" and the frequency they are performed.  For 
example:

Solder paste height inspection
Glue dot inspection
Inspect after reflow/glue cure(100% or audit?)
Inspect after wave solder(100% or audit?)
Thru-hole insertion inspection
BON testing
Any other inspections

Your answers will be appreciated.  Depending upon the responses, I will 
issue a summary in the near future

E. Holton
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