-- [ From: michael carano * EMC.Ver #2.10P ] --


------- FORWARD, Original message follows -------

> Date: Tuesday, 09-Jan-96 07:16 PM
> 
> From: michael carano           \ PRODIGY:     (GNTB07A)
> 
> Subject: PEELING TIN LEAD
> 
> HAVE YOU TRIED LOKKING AT THE AMOUNT OF COPPER DRAG-IN IN THE ACID
DIP
> PRIOR TO TIN-LEAD PLATE?
> COPPER BUILDUP,CAN SOMETIMES REDUCE THE EFFECTIVENSS OF THE ACID DIP.
> ALSO, IS YOUR PHOTO RESIST LEACHING OUT ONTO THE COPPER TRACES OR
PADS?
> SOME DRY FILMS LEACH MORE THAN OTHERS AND CAN LEAVE A RESIDUE ON THE
> COPPER SURFACE AFTER COPPER PLTE  OR IN THE EARLY STAGES OF THE TIN-
LEAD
> PLATING CYCLE. iF YOUR RINSE WATER TEMP IS TOO HOT, THIS COULD LEAD
TO
> OXIDATION OF THE COPPER SURFACE.  

------- FORWARD, End of original message -------