 
| Subject: | |
| From: | |
| Date: | Wed, 6 Nov 1996 7:32:26 -0500 |
| Content-Type: | text/plain |
| Parts/Attachments: |
|
|
Does anyone have experience in the encapsulation of Alloy 42 TSOP solder
joints ? Has anyone used an electrically conducting polymer or non-conducting
polymer for solder joint strength enhancement? Our parts have 20 mil pitch.
What has been found to be an appropriate max. reflow temp. and over liquidous
time for soldering Alloy 42 TSOP leads and also Copper TSOP leads?
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
