Thanks for the mail. The cost of each disk will be L99 + VAT in Europe. Payment
may be made by a sterling cheque provided it is from a UK bank based in the UK
Credit Card transaction may also be arranged.
The disk will be available at the end of the month the defect albums are
available now.
New Conventional Assembly Defects Photo Album
This CD ROM provides the process or quality engineer with a source of
photographs of process defects which may be used in company inspection
documents, training material or presentations. They may be simply pasted into
any document for in house company use. Each photograph is provided as a .Tiff
file format.
The disk includes examples of the following:
Component lifting, Component damage, Contamination, Pin Holes, Blow Holes, PCB
Microsections, Solder Spikes, Poor Solder Penetration, Poor Fluxing,
Delamination, Sunken Joints, Cracked Joints, Lifted Pads, Poor Through Hole
Plating, Resist Lifting, Legend Ink Contamination, Solder Balls, lead Damage,
Corrosion, Voiding, Damaged Components, Non Wetting, De Wetting, Dendrite
Growth, Microsections of good through plating and poor plating, Contamination in
through holes, Resist in through holes etc.
Bob Willis Surface Mount Process Defect Guide
The first CD ROM provides a guide to common process defects found at each stage
of the SMT process. It also includes defects specifically on printed boards and
components. At the first screen you select the process you want to view which
gives you an introduction to the processes listed below.
Printed Boards, Components inc; BGA, Screen Print, Adhesive Application,
Placement, Reflow Solder, Wave Solder, Cleaning, Rework
In the case of printed board section it explains the most important issues with
surface mount circuits. It then lists common process defects which can be
selected to reveal a photographic example of the defect type and an explanation
of the possible causes.
This disk will form part of the forthcoming Bob Willis Master Class Series
Surface Mount Process Defects Photo Album
This CD ROM provides the process or quality engineer with a source of
photographs of process defects which may be used in company inspection document
or presentations. They may be simply pasted into any document for in house
company use. Each photograph is provided as a .Tiff file format.
The disk includes examples of the following:
Chip Leaching, Poor Solderability, Plastic Cracking, BGA Misplacement, BGA
Cracking, BGA Cracking, Capacitor Cracking, Plastic Softening, QFP Cracking,
Solder Beading, Crystallised Joints, Cracked Joint, Poor Pad Wetting, Component
Lift, No Wetting, Joint Failure, Joint Voiding, Solder Wicking, Component
Lifting, Solder Short, Non Reflow, PCB Measeling, Poor Penetration, Solder
Skip, Bulbous Joint, Blow Hole, Solder Webbing, Adhesive Contamination,
Adhesive Stringing, Excess Adhesive, Misplaced Lead, Misplaced Component,
Dendrite Growth, Corrosion, Solder Spikes, Flux Residues, Joint Cracking,
Pad Lifting etc
Surface Mount Inspection Standards
The CD ROM provides a simple tutorial on inspection of surface mount assemblies.
It covers adhesive application, placement and soldering. The four main
termination's are covered, chip, gull wing, J Lead and castillation. The
criteria is given with each example which is in line with the current European
and IPC standards.
A test section is include which allows staff to asses there understanding of the
standard against actual solder joints examples. This provides assessment against
the basic criteria in the standard.
Also included on the CD ROM is an inspection standard which can be modified or
printed out with illustrations for a company training document or inspection
standard.
Conventional Soldering Standards
The CD ROM provides a simple tutorial on inspection of conventional assemblies.
It covers lead length, lead clench and soldering of components and wire
termination's. Single sided, double sided boards are illustrated. The criteria
is given for each example which is in line with the current European and IPC
standards.
A test section is include which allows staff to asses there understanding of the
standard against actual solder joints examples. This provides assessment against
the basic criteria in the standard.
Also included on the CD ROM is a inspection standard which can be modified or
printed out with illustrations for a company training document or inspection
standard.
Bob Willis
Electronic Presentation Services
2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England.
Tel: (44) 01245 351502
Fax: (44) 01245 496123
Home Page: http://ourworld.compuserve.com/homepages/bwillis
Email: [log in to unmask]
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